V. Giurgiutiu, C. Rogers, Electro-mechanical (E/M) impedance method for structural health monitoring and nondestructive evaluation, Structural Health Monitoring—Current Status and Perspective, (1997) 18-20.
 G. Park, H.H. Cudney, D.J. Inman, Feasibility of using impedance‐based damage assessment for pipeline structures, Earthquake engineering & structural dynamics, 30(10) (2001) 1463-1474.
 S. Bhalla, A.S.K. Naidu, C.K. Soh, Influence of structure-actuator interactions and temperature on piezoelectric mechatronic signatures for NDE, in: Smart Materials, Structures, and Systems, International Society for Optics and Photonics, 2003, pp. 263-270.
 K.-Y. Koo, S. Park, J.-J. Lee, C.-B. Yun, Automated impedance-based structural health monitoring incorporating effective frequency shift for compensating temperature effects, Journal of Intelligent Material Systems and Structures, 20(4) (2009) 367-377.
 G. Park, K. Kabeya, H.H. Cudney, D.J. Inman, Impedance-based structural health monitoring for temperature varying applications, JSME International Journal Series A Solid Mechanics and Material Engineering, 42(2) (1999) 249-258.
 A. Bastani, H. Amindavar, M. Shamshirsaz, N. Sepehry, Identification of temperature variation and vibration disturbance in impedance-based structural health monitoring using piezoelectric sensor array method, Structural Health Monitoring, 11(3) (2012) 305-314.
 N. Sepehry, M. Shamshirsaz, F. Abdollahi, Temperature variation effect compensation in impedance-based structural health monitoring using neural networks, Journal of Intelligent Material Systems and Structures, 22(17) (2011) 1975-1982.
 N. Sepehry, M. Shamshirsaz, A. Bastani, Experimental and theoretical analysis in impedance-based structural health monitoring with varying temperature, Structural Health Monitoring, 10(6) (2011) 573-585.
 V. Giurgiutiu, Structural health monitoring: with piezoelectric wafer active sensors, Academic Press, 2007.
 A.N. Zagrai, V. Giurgiutiu, Electro-mechanical impedance method for crack detection in thin wall structures, in: 3rd Int. Workshop of Structural Health Monitoring, 2001, pp. 12-14.
 S. Bhalla, C.K. Soh, Electromechanical impedance modeling for adhesively bonded piezo-transducers, Journal of Intelligent Material Systems and Structures, 15(12) (2004) 955-972.
 D.M. Peairs, D.J. Inman, G. Park, Circuit analysis of impedance-based health monitoring of beams using spectral elements, Structural Health Monitoring, 6(1) (2007) 81-94.
 S. Bhalla, C.K. Soh, Structural health monitoring by piezo-impedance transducers. I: Modeling, Journal of Aerospace Engineering, 17(4) (2004) 154-165.
 W. Yan, W. Chen, C. Lim, J. Cai, Application of EMI technique for crack detection in continuous beams adhesively bonded with multiple piezoelectric patches, Mechanics of Advanced Materials and Structures, 15(1) (2008) 1-11.
 U. Lee, Spectral element method in structural dynamics, John Wiley & Sons, 2009.
 Y. Kiani, S. Taheri, M. Eslami, Thermal buckling of piezoelectric functionally graded material beams, Journal of Thermal Stresses, 34(8) (2011) 835-850.