Thermo-Electro Mechanical Impedance based Structural Health Monitoring: Euler- Bernoulli Beam Modeling

Document Type : Research Article

Authors

1 Faculty of Mechanical and Mechatronics Engineering, Shahrood University of Technology, Shahrood, Iran

2 Dept. of Mechanical Engineering, Amirkabir University of Technology, Tehran, Iran

3 New Technologies Research Center, Amirkabir University of Technology, Tehran, Iran

Abstract

In recent years, impedance measurement method by piezoelectric (PZT) wafer active
sensor (PWAS) has been widely adopted for non-destructive evaluation (NDE). In this method, the
electrical impedance of a bonded PWAS is used to detect a structural defect. The electro-mechanical
coupling of PZT materials constructs the original principle of this method. Accordingly, the electrical
impedance of PWAS can sense any change in the mechanical impedance of the structure. A thermal
stress on a structure, which was generated by environmental temperature, could change the electrical
impedance of PWAS. The thermal stress which affects the output impedance of PWAS is also
developed. A temperature-dependent model, the temperature dependency of PWAS, and structure
material properties are investigated for a PWAS bonded to an Euler Bernoulli clamped-clamped beam.
The Rayleigh-Ritz and spectral element methods are studied and, then, verified by 3D finite element
method (FEM).

Highlights

[1] V. Giurgiutiu, C. Rogers, Electro-mechanical (E/M) impedance method for structural health monitoring and nondestructive evaluation, Structural Health Monitoring—Current Status and Perspective,  (1997) 18-20.

[2] G. Park, H.H. Cudney, D.J. Inman, Feasibility of using impedance‐based damage assessment for pipeline structures, Earthquake engineering & structural dynamics, 30(10) (2001) 1463-1474.

[3] S. Bhalla, A.S.K. Naidu, C.K. Soh, Influence of structure-actuator interactions and temperature on piezoelectric mechatronic signatures for NDE, in:  Smart Materials, Structures, and Systems, International Society for Optics and Photonics, 2003, pp. 263-270.

[4] K.-Y. Koo, S. Park, J.-J. Lee, C.-B. Yun, Automated impedance-based structural health monitoring incorporating effective frequency shift for compensating temperature effects, Journal of Intelligent Material Systems and Structures, 20(4) (2009) 367-377.

[5] G. Park, K. Kabeya, H.H. Cudney, D.J. Inman, Impedance-based structural health monitoring for temperature varying applications, JSME International Journal Series A Solid Mechanics and Material Engineering, 42(2) (1999) 249-258.

[6] A. Bastani, H. Amindavar, M. Shamshirsaz, N. Sepehry, Identification of temperature variation and vibration disturbance in impedance-based structural health monitoring using piezoelectric sensor array method, Structural Health Monitoring, 11(3) (2012) 305-314.

[7] N. Sepehry, M. Shamshirsaz, F. Abdollahi, Temperature variation effect compensation in impedance-based structural health monitoring using neural networks, Journal of Intelligent Material Systems and Structures, 22(17) (2011) 1975-1982.

[8] N. Sepehry, M. Shamshirsaz, A. Bastani, Experimental and theoretical analysis in impedance-based structural health monitoring with varying temperature, Structural Health Monitoring, 10(6) (2011) 573-585.

[9] V. Giurgiutiu, Structural health monitoring: with piezoelectric wafer active sensors, Academic Press, 2007.

[10] A.N. Zagrai, V. Giurgiutiu, Electro-mechanical impedance method for crack detection in thin wall structures, in:  3rd Int. Workshop of Structural Health Monitoring, 2001, pp. 12-14.

[11] S. Bhalla, C.K. Soh, Electromechanical impedance modeling for adhesively bonded piezo-transducers, Journal of Intelligent Material Systems and Structures, 15(12) (2004) 955-972.

[12] D.M. Peairs, D.J. Inman, G. Park, Circuit analysis of impedance-based health monitoring of beams using spectral elements, Structural Health Monitoring, 6(1) (2007) 81-94.

[13] S. Bhalla, C.K. Soh, Structural health monitoring by piezo-impedance transducers. I: Modeling, Journal of Aerospace Engineering, 17(4) (2004) 154-165.

[14] W. Yan, W. Chen, C. Lim, J. Cai, Application of EMI technique for crack detection in continuous beams adhesively bonded with multiple piezoelectric patches, Mechanics of Advanced Materials and Structures, 15(1) (2008) 1-11.

[15] U. Lee, Spectral element method in structural dynamics, John Wiley & Sons, 2009.

[16] Y. Kiani, S. Taheri, M. Eslami, Thermal buckling of piezoelectric functionally graded material beams, Journal of Thermal Stresses, 34(8) (2011) 835-850.

Keywords

References

[1] V. Giurgiutiu, C. Rogers, Electro-mechanical (E/M) impedance method for structural health monitoring and nondestructive evaluation, Structural Health Monitoring—Current Status and Perspective,  (1997) 18-20.
[2] G. Park, H.H. Cudney, D.J. Inman, Feasibility of using impedance‐based damage assessment for pipeline structures, Earthquake engineering & structural dynamics, 30(10) (2001) 1463-1474.
[3] S. Bhalla, A.S.K. Naidu, C.K. Soh, Influence of structure-actuator interactions and temperature on piezoelectric mechatronic signatures for NDE, in:  Smart Materials, Structures, and Systems, International Society for Optics and Photonics, 2003, pp. 263-270.
[4] K.-Y. Koo, S. Park, J.-J. Lee, C.-B. Yun, Automated impedance-based structural health monitoring incorporating effective frequency shift for compensating temperature effects, Journal of Intelligent Material Systems and Structures, 20(4) (2009) 367-377.
[5] G. Park, K. Kabeya, H.H. Cudney, D.J. Inman, Impedance-based structural health monitoring for temperature varying applications, JSME International Journal Series A Solid Mechanics and Material Engineering, 42(2) (1999) 249-258.
[6] A. Bastani, H. Amindavar, M. Shamshirsaz, N. Sepehry, Identification of temperature variation and vibration disturbance in impedance-based structural health monitoring using piezoelectric sensor array method, Structural Health Monitoring, 11(3) (2012) 305-314.
[7] N. Sepehry, M. Shamshirsaz, F. Abdollahi, Temperature variation effect compensation in impedance-based structural health monitoring using neural networks, Journal of Intelligent Material Systems and Structures, 22(17) (2011) 1975-1982.
[8] N. Sepehry, M. Shamshirsaz, A. Bastani, Experimental and theoretical analysis in impedance-based structural health monitoring with varying temperature, Structural Health Monitoring, 10(6) (2011) 573-585.
[9] V. Giurgiutiu, Structural health monitoring: with piezoelectric wafer active sensors, Academic Press, 2007.
[10] A.N. Zagrai, V. Giurgiutiu, Electro-mechanical impedance method for crack detection in thin wall structures, in:  3rd Int. Workshop of Structural Health Monitoring, 2001, pp. 12-14.
[11] S. Bhalla, C.K. Soh, Electromechanical impedance modeling for adhesively bonded piezo-transducers, Journal of Intelligent Material Systems and Structures, 15(12) (2004) 955-972.
[12] D.M. Peairs, D.J. Inman, G. Park, Circuit analysis of impedance-based health monitoring of beams using spectral elements, Structural Health Monitoring, 6(1) (2007) 81-94.
[13] S. Bhalla, C.K. Soh, Structural health monitoring by piezo-impedance transducers. I: Modeling, Journal of Aerospace Engineering, 17(4) (2004) 154-165.
[14] W. Yan, W. Chen, C. Lim, J. Cai, Application of EMI technique for crack detection in continuous beams adhesively bonded with multiple piezoelectric patches, Mechanics of Advanced Materials and Structures, 15(1) (2008) 1-11.
[15] U. Lee, Spectral element method in structural dynamics, John Wiley & Sons, 2009.
[16] Y. Kiani, S. Taheri, M. Eslami, Thermal buckling of piezoelectric functionally graded material beams, Journal of Thermal Stresses, 34(8) (2011) 835-850.
AUT Journal of Modeling and Simulation
Volume 49, Issue 2
December 2017
Pages 143-152

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